About Us
Corporate Development
1920 | Founding of Ueda Plating Factory |
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1956 | Changed co. name to Ueda Plating Industry, established limited company at Higashiyama, Kyoto with. paid-up capital 500,000 yen |
1963 | Inaugural of Katsuji Ueda Established Shirakawa Factory in Kyoto |
1967 | Newly-built Gojyo Factory in Saiin Ukyo-ward, Kyoto City |
1969 | Established Nougata Factory in Fukuoka |
1971 | Independence of Nougata Factory as ASKA Corporation Established Yamazaki Seikin as specialized electronic part factory |
1973 | Semiconductor Lead Frame Full Surface Silver Plating started at Higashiyama Factory |
1974 | Developed originally Tin plating and partially Silver plating |
1975 | Started Semiconductor Lead Frame partially Silver plating |
1978 | Inaugural of current President, Mr. Hirokazu Ueda |
1982 | Specialized IC plating factory started in Yamanouchi Factory, Ukyo-ward, Kyoto City |
1986 | Amendment of Organization Chart and company name to Ueda Plating Co., Ltd. |
1988 | Increased paid-up capital to 25,000,000 yen Installation of Connector Hoop plating in Gojyo Factory |
1989 | Established Ueda Plating in Malaysia |
1992 | Established Hokuriku Factory in Noto Industrial Centre, Ishikawa Prefecture |
1996 | ISO9002 Certification to Yamanouchi Factory |
1997 | ISO9002 Certification to Ueda Plating Malaysia |
1998 | ISO9002 Certification to Gojyo Factory ISO9002 Certification to Hokuriku Factory Elected as Model factory for Kyoto Prefecture SMI |
2004 | Integrated 3 factories into 1 system [ISO9000 QMS] Certification of KES Environmental System, Step 2 Built a Technology R&D Center, near to Gojyo Factory |
2006 | Ueda Plating Malaysia built it’s 3rd Factory |
2008 | Increased Paid-up Capital to 74,550,000 yen |
2009 | Integration of Gojo and Yamanouchi factory as Kyoto factory |
2010 | Introduction of Ag plating equipment for LED base |
2011 | Extension of Ag plating equipment for LED base |
2012 | Introduction of partial Au plating equipment |
2013 | Overhaul of organization |