To Ueda and gold quality and advanced technology, scientific precision plating of plated-plated nickel-plated copper-plated tin-plated gold-plated silver-plated electroless plating

Because the design of the part became a stand-alone pattern, the part can be plated only by electroless plating. It caused an increase in cost and declined speed. We have found a way to plate only the back side of the part to save in cost.

Appearance of the Au after plating

A production which is composed by 0.3mm in width rectangular wires insulated with 0.5mm pitches has peeling problem when it has bad electrical contact. We have found out a hoop plating method that will never have bad electrical contact in principle.

FPC connector

BtoB connector

Usually, because it is impossible to cordon the nickel barrier area, spalling by laser is used. We introduced a special partial plating to cordon the nickel barrier area. This reduced the usage of Au and disestablished the process of spalling.

To improve productivity of reed shape products, we make a hoop by connecting them. In that regard, we minimize the　misalignment of the joints by arranging the joints just like the picture on the left.

Whisker is one of the big problems of Sn plating since use of Pb is prohibited. Whisker tends to occur a part such as a joint where is under external pressure. One of the countermeasures for whisker is reflow after plating. We retrofit partial Sn plating and reflow process in a hoop line.